Use Case

 Company Overview 

Semiconductor Back-End Company L is an outsourced semiconductor assembly and test provider specializing in wafer-bumping technologies. Since launching Korea’s first fully equipped flip-chip wafer-bumping operation in 2000, it has expanded from gold bumping for display driver integrated circuits to solder bumping, copper-pillar bumping, and wafer-level chip-scale packaging.

 Customer Needs 

Complex gold-processing and work-in-progress revenue processes reduced efficiency. The company also needed a systematic environment capable of supporting different customer billing models.

 Why Woongjin and the Solution Were Chosen 

Company L selected SAP S/4HANA as its next-generation ERP platform. The solution offered integrated capabilities tailored to semiconductor back-end operations, real-time data integration, flexible manufacturing-history traceability, and standardized processes.

 Results 

Standard processes enabled faster execution and information access. Real-time integration of sales, production, purchasing, and accounting improved management transparency and accuracy, while multidimensional profitability analysis strengthened decision-making. Automated gold management and work-in-progress revenue processes simplified work and increased productivity. Integrated data and processes also established consistent management and systematic operations.

 Project Keywords 

#SAPS4HANA #SemiconductorBackEnd #RealTimeIntegration #ProfitabilityAnalysis #ProcessStandardization